Low dielectric constant insulating film, method of forming it, and electric circuit using it

摘要

The present invention provides a low dielectric insulating film having low relative dielectric constant, high mechanical strength and high adhesion to substrates, i.e. a low dielectric constant insulating film having one-dimensional through channels from one surface to the other surface and having a relative dielectric constant of at most 3, thus suitable for use as an interlayer film, wherein the film is formed by removing columnar phases from a composite film comprising many columnar phases one-dimensionally grown on the substrate and a matrix phase surrounding them.