发明名称 Conductive paste, its manufacturing method, and printed wiring board using the same
摘要 A conductive paste has conductive particles having metal particle surface coated with a complex of same metal of less than 10 nm in thickness and not having spontaneous oxide film on said metal particles, and a binder mainly composed of an insulating resin.
申请公布号 US6488869(B2) 申请公布日期 2002.12.03
申请号 US19980056774 申请日期 1998.04.08
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 TAKEZAWA HIROAKI;ITAGAKI MINEHIRO;BESSHO YOSHIHIRO
分类号 H01B1/22;H05K1/09;H05K3/32;H05K3/40;(IPC1-7):H01B1/02 主分类号 H01B1/22
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