发明名称 |
Conductive paste, its manufacturing method, and printed wiring board using the same |
摘要 |
A conductive paste has conductive particles having metal particle surface coated with a complex of same metal of less than 10 nm in thickness and not having spontaneous oxide film on said metal particles, and a binder mainly composed of an insulating resin.
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申请公布号 |
US6488869(B2) |
申请公布日期 |
2002.12.03 |
申请号 |
US19980056774 |
申请日期 |
1998.04.08 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
TAKEZAWA HIROAKI;ITAGAKI MINEHIRO;BESSHO YOSHIHIRO |
分类号 |
H01B1/22;H05K1/09;H05K3/32;H05K3/40;(IPC1-7):H01B1/02 |
主分类号 |
H01B1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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