发明名称 Method of forming a capacitor with high capacitance and low voltage coefficient
摘要 The present invention provides a method of forming a capacitor in an integrated circuit. The method comprises providing a semiconductor substrate having a conductive layer thereon. The partial conductive layer is removed to form an electrode. A plurality of first dopants are implanted on a surface of the electrode to form a first doped region. Then a plurality of second dopants are implanted into the electrode to form a second doped region below the first doped region. Then the capacitor is formed comprising the electrode. The first doped region and the second region can reduce voltage coefficient as well as increase capacitance of the capacitor.
申请公布号 US6489196(B1) 申请公布日期 2002.12.03
申请号 US20020055943 申请日期 2002.01.28
申请人 UNITED ELECTRONICS CORP. 发明人 LIN MING-YU;WANG HSUEH-WEN
分类号 H01L21/02;H01L21/82;H01L21/822;H01L21/8242;(IPC1-7):H01L21/824 主分类号 H01L21/02
代理机构 代理人
主权项
地址