发明名称 |
Molded tape ball grid array package |
摘要 |
A molded tape ball grid array package includes a molding compound and a tape substrate having a top surface for mounting a die thereon, a bottom surface for attaching solder balls, and vias for forming connections between the solder balls and the die wherein the molding compound surrounds the die and the tape substrate.
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申请公布号 |
US6489571(B1) |
申请公布日期 |
2002.12.03 |
申请号 |
US20000703199 |
申请日期 |
2000.10.31 |
申请人 |
LSI LOGIC CORPORATION |
发明人 |
CHIA CHOK J.;LOW QWAI H.;VARIOT PATRICK |
分类号 |
H01L23/31;H01L23/498;(IPC1-7):H05K1/09 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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