| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin film forming device capable of forming a uniform thin film by supplying coating liquid mist onto a substrate surface with excellent in-plane uniformity, and forming a thin film of high quality by effectively collecting surplus coating mist which is scattered from the substrate surface of the coating liquid mist. SOLUTION: The range of ejection of a resist mist 52 is narrowed to a coating area 44, the resist mist 52 is uniformly supplied to the substrate surface, and the in-plane uniformity of the thin film is enhanced. Furthermore, an ejection nozzle 40 is arranged in the upper position of the substrate surface of the ejection nozzle 40 and supplies the resist mist 52 to the coating area 44 so as to make an acute angle with respect to a perpendicular 48 of the coating area 44, and on the contrary, a suction nozzle 42 is arranged in the upper position of the substrate surface and on the opposite side of the ejection nozzle 40 sandwiching the perpendicular 48, and surplus resist mist 54 which is scattered from the coating area 44 is effectively sucked by the suction nozzle 42. |
