发明名称 PTC fuse including external heat source
摘要 An improved PTC fuse assembly is described. The PTC fuse assembly includes a PTC fuse having a PTC material. To expedite heating of the PTC material, the improved PTC fuse assembly includes a die package in thermal communication with the PTC material. The die package includes a die which is responsible generating heat once a threshold has been reached. To mount the die package to a printed circuit board, the die package includes leads. The leads are sufficiently flexible such that the heat generated by the die does not compromise performance of the PTC protection circuit.
申请公布号 US6489879(B1) 申请公布日期 2002.12.03
申请号 US19990549240 申请日期 1999.12.10
申请人 NATIONAL SEMICONDUCTOR CORPORATION 发明人 SINGH INDERJIT;TAKIAR HEM;MURRAY GEOFFREY CADE
分类号 H01C1/08;H01C1/14;H01M2/34;H01M6/50;(IPC1-7):H01H85/044;H01H85/143 主分类号 H01C1/08
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