发明名称 Method of making a semiconductor device
摘要 A method of making a semiconductor device includes the steps of etching, with a resist pattern (3) used as a mask, a contact pattern (4) in at least one interlayer insulation film (2) made on a silicon substrate (1); forming on the contact pattern an insulation film (5) containing silicon as a main component; and oxidizing by heat treatment the insulation film to provide an oxide film (6) including a side wall oxide film on an inside wall of the contact pattern.
申请公布号 US6489234(B1) 申请公布日期 2002.12.03
申请号 US20000664764 申请日期 2000.09.19
申请人 OKI ELECTRIC INDUSTRY CO., LTD. 发明人 ITOH YOSHIO
分类号 H01L21/302;H01L21/28;H01L21/3065;H01L21/311;(IPC1-7):H01L21/306 主分类号 H01L21/302
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