| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing an IC card, that can reduce a defective fraction. SOLUTION: A wire 4 led out of a supersonic hone is allowed to pass on a pattern 3a of a lead frame electrode 3, and to revolve several times on a resin layer 2 along the part of the edge of an IC card, and to pass through on a pattern 3b. A revolving part 4c is allowed to act as an antenna coil. The part of the wire 4 which is brought into contact with the resin layer 2 is mixed with the resin layer 2 after the insulating coating is fused by ultrasonic vibration, and the wire 4 is embedded in the resin layer 2. Also, the part of the wire 4 on the pattern 3a and the pattern 3b is pressured to those patterns and fixed by a fusing head, and fixed so as to be made electrically conductive. The wire 4 is fixed so as to be positioned on the patterns 3a and 3b so that the wire 4 can be fixed while the electric connected state is visualized. Thus, it is possible to reduce the defective fraction.</p> |
