APPARATUS FOR ETCHING WAFER BACK

摘要

PROBLEM TO BE SOLVED: To fundamentally prevent wafer damage in the separation of a wafer where etching has been completed in a process for etching a wafer back. SOLUTION: Etching liquid is supplied into an etching tank 45 through a supply section 35 fitted onto a lower surface, a wafer back arranged on the support rest 42 at the upper end of an etching dam is uniformly etched by the flow of the etching liquid, and the etching liquid for generating surface tension after the etching is completed is discharged from the etching tank 45 through a first discharge section 47.