| 摘要 |
PURPOSE: A base of a semiconductor package, a semiconductor package using the same, and a fabricating method thereof are provided to fabricate a ball grid array type chip scale package by using two sheets of lead frame. CONSTITUTION: The first lead frame portion includes the first outline portion, the first pad(106), and the first leads(104). The first outline portion has a rectangular shape. The first pad(106) is connected with the first outline portion by the second connection portion. The first leads(104) are connected with the outline portion by the first connection portion. The second lead frame portion includes the second leads(124). The second pad is formed at a center of the second outline portion(122). The second pad is connected by the second connection portion. The second pad is used as a heat-sink pad. The second leads(124) are formed around the second pad.
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