| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of forming a composite passive component on a ceramic or glass substrate and packaging the workpiece by a thick-film packaging method, where the volume of the component is reduced, yield is enhanced, and manufacturing cost is lowered. SOLUTION: The manufacturing method for composite passive component includes a first process, in which a substrate is formed using ceramic or glass as the material and the substrate is planarized by enameling or polishing; a second process, in which a composite passive component is formed on the substrate using semiconductor manufacturing processes; and a third process, in which the composite passive component thus formed is packaged by a thick-film packaging method.
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