| 摘要 |
<p>PURPOSE: A lead frame and a semiconductor package using the same are provided to maximize performance of a semiconductor chip by forming the lead frame having improved heat-sink capacity. CONSTITUTION: A lead frame is formed with the first lead frame, an adhesive, and the second lead frame. In the first lead frame, a rectangular chip loading plate(13) is formed on a space portion(22). A plurality of tie bars(14) are extended from four edges of the chip loading plate(13). A plurality of inner leads(15) are arranged on an outer circumference of the chip loading plate(13). The inner leads(15) are connected by a dam bar(16). An outer lead extended from the inner lead(15) is formed at an outer circumference of the dam bar(16). In the second lead frame, a plurality of inner leads(25) are formed on an outer circumference of the space portion(22). The inner leads(25) are connected by a dam bar(26). A plurality of outer leads(27) are formed on an outer circumference of the dam bar(26). The outer leads(28) are connected with a frame(28).</p> |
