发明名称 POLYAMIDE COMPOSITION
摘要 PURPOSE: A polyamide composition and a molded product comprising the composition are provided, which composition shows excellent moldability, toughness, lightweightness, hot water and steam resistance, heat resistance, mechanical properties, low water absorption, chemical resistance and melt stability. CONSTITUTION: The polyamide composition comprises 50-90 parts by weight of the semi-aromatic polyamide containing a dicarboxylic acid unit containing 60-100 mol% of a terephthalic acid unit and a diamine unit containing 60-100 mol% of a 1,9-nonanediamine unit and/or 2-methyl-1,8-octanediamine; and 10-50 parts by weight of the aliphatic polyamide whose average number of the total carbon atoms of a dicarboxylic acid unit and a diamine unit per a amide group is 7-12. Optionally the polyamide composition comprises further 0.1-20 parts by weight of a metal hydroxide and/or a metal oxide; 1-100 parts by weight of a bromine-containing flame retardant and/or 0.1-50 parts by weight of a flame retardancy promoter; 0.01-10 parts by weight of a nucleating agent; and/or 0.1-200 parts by weight of a filler, based on 100 parts by weight of the semi-aromatic polyamide and the aliphatic polyamide.
申请公布号 KR20020089187(A) 申请公布日期 2002.11.29
申请号 KR20020028065 申请日期 2002.05.21
申请人 KURARAY CO., LTD. 发明人 HARA TETSUYA;UCHIDA KOICHI
分类号 C08L77/00;C08L77/02;C08L77/06;C08L81/04;(IPC1-7):C08L77/00 主分类号 C08L77/00
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