| 摘要 |
PROBLEM TO BE SOLVED: To transmit a high-speed signal between respective semiconductor elements without being affected by crosstalk noise in an MCP type semiconductor device having a chip-on-chip structure. SOLUTION: A wiring layer 8B compound of a flat solid layer made of a conductive material is arranged between a plurality of semiconductor elements 2A and 2B laminated by flip-chip bonding. The layer 8B is connected to grounding terminals 8C of the elements 2A and 2B or to a power source terminal. |
