TAPE CARRIER FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To improve the resin damming effect of a seal resin by grooves formed on the surface of an insulation film, thereby improving the productivity of semiconductor device manufacture having a tape carrier for the semiconductor device and a BGA type chip size package using the same. SOLUTION: A groove 20 having a zonal sectional shape is formed on the surface of an insulation film 5 existing between a wire bonding window hole 18 and an opening for a solder ball 12 nearest thereto, thereby forming a structure of blocking a seal resin from flowing into the opening for a solder ball 12.