| 摘要 |
PROBLEM TO BE SOLVED: To more accurately evaluate the reliabilty of insulation between the through holes of a wiring board at the time of forming an actual circuit by forming an evaluation pattern in the same condition as that of an actual wiring board. SOLUTION: An evaluating pattern 11 for evaluating the insulation reliability between through holes is formed on the wiring board 10 and part 14 of the pattern of the real circuit is formed around the pattern 11. Consequently, the residual copper rate of the wiring board 10 becomes almost equal to that of a wiring board on which the real circuit is formed. Therefore, the balance between a resin and the through holes become the same as that of the wiring board on which the actual circuit is formed and the insulation reliability between the through holes can be evaluated under the same condition as that set to the actual wiring board.
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