摘要 |
PROBLEM TO BE SOLVED: To provide a heat treatment device capable of efficiently and uniformly heating a substrate. SOLUTION: The heat treatment device 1 has a plurality of lamps 20 for heating a substrate W. Each lamp 20 has a slender filament 21 and a part 22 having the filament 21 therein. Moreover, the filament 21 is arranged in a state where its direction of length is inclined at a predetermined inclined angleθwith respect to the normal direction of the substrate W. The plurality of lamps 20 are arranged close to each other such that when the filament 21 or the part 22 is imaginarily projected to an imaginary projecting plane F having a direction AR2 normal to a direction of length AR1 of the filament 21 as a normal direction, the projecting regions Ra to Rc of the respective filaments 21 do not overlap each other or the projecting regions Qa to Qc of the parts 22 do not overlap each other.
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