| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer-polishing apparatus that can correct film thickness/ film quality distribution that changes in a radial direction moderately, and polishing shape distribution. SOLUTION: This wafer polishing apparatus 10 has a diaphragm 40 that varies distance to a protection sheet 34 of a plurality of air jet holes 36, 36, and the like provided on the surface of a carrier 24, thus forming pressure distribution that changes continuously in the clearance between the carrier 24 and protection sheet 34, and giving the pressure distribution to a wafer W via the protection sheet 34 for polishing the wafer W. |
