BGA WIRING SUBSTRATE, MANUFACTURING METHOD THEREFOR AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To reduce the warp of a BGA wiring board as much as possible or to substantially eliminate it and to improve connection reliability when it is mounted on the other printed wiring board. SOLUTION: Solder resist layers 13a and 13b as protection films are arranged on both sides of the board 12 constituted of an insulating material. The opening part of a mold gate 14 to which resin is injected at the time of sealing the mounted semiconductor chip is made in a part corresponding to the prescribed area of the board 12. An opening part 15 whose shape is almost similar to the mold gate 14 is arranged in a part which is face-symmetrical to the mold gate 14 across the board 12 in the solder resist layer 13b of a ball junction side.