| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed board hardly deformed and having superior conductivity only by a dry process easily without contaminating circumstances. SOLUTION: After a sheet of paper 2 is stuck to both faces of a base 1 made of insulating material with a water-soluble glue, each through hole 3 is formed at necessary positions. After the inside of the through hole 3 is filled with a conductive paste 4 in such a manner that the face of the through hole 3 is made flush with the surface of the paper 2, the paper 2 is peeled. A copper foil with an adhesive stuck on one face thereof is stuck to both faces of the base 1 in such a manner that the face of the copper foil is jointed to the surface of the conductive paste 4. After that, the copper foil is etched to form a wiring pattern.
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