发明名称 BONDING METHOD OF FLEXIBLE WIRING BOARD, FLEXIBLE WIRING BOARD, INK JET HEAD UNIT, INK JET RECORDING UNIT
摘要 PROBLEM TO BE SOLVED: To improve reliability in electric connection, by keeping flatness of a contact pad. SOLUTION: The flexible wiring board 11 is bonded and supported to a supporting member 13 with a heat-curable adhesive 12. The flexible wiring board 11 has a contact pad 11b used for electrical connection to the outside and a wiring 11a connected with the contact pad 11b. The area of the conductive region made up of the contact pad 11b and the wiring 11a in the flexible wiring board 11 is larger than that of the region, in which there are no conductor. In the supporting member 13, at least a region corresponding to the contact pad 11b is made flat.
申请公布号 JP2002344130(A) 申请公布日期 2002.11.29
申请号 JP20010144905 申请日期 2001.05.15
申请人 CANON INC 发明人 SAITO RIICHI
分类号 B41J2/01;H01L21/60;H05K3/38;(IPC1-7):H05K3/38 主分类号 B41J2/01
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