| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat treatment device capable of preventing a byproduct adhering to the inside surfaces of a joint and an exhaust pipe from dropping to the bottom end side of a process tube and thus to prevent a substance to be treated from being contaminated. SOLUTION: In the heat treatment device having a boat 8 for placing a semiconductor wafer (substance to be treated) thereon and capable of moving up and down in a process tube 1, a tray 9 for recovering the byproduct dropping from an exhaust port 1a to which the exhaust pipe 3 is connected via a joint 4 is mounted on the top plate 8a of the boat 8.
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