| 摘要 |
PROBLEM TO BE SOLVED: To improve product quality and yield by properly performing processing in a treatment mode in a device for rotating type wafer processing having a plurality of kinds of treatment modes in which predetermined processing for a wafer is performed, while rotating the wafer, and to provide a method for the same. SOLUTION: When the velocity of a wafer-supporting board 11 is increased to a maximum velocity Vmax, in end portion 131 of a center support pin 13 is lowered to a lowest position Hmin. As a result, the height of the central surface of the wafer is considerably lower than that of the periphery in a bowl- like shape. The wafer is dried by shaking into such a bent state. Thus, by supporting a wafer W in a smoothly bent state, local corrugations (depressions and projections) of the wafer W can be prevented, and vibration of the wafer can be suppressed, even when the wafer is rotated at a high speed.
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