发明名称 PASTE-IMPARTING APPARATUS AND METHOD TO ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To reduce variations in the given thickness of a conductive paste given for forming a side-surface electrode, which extends with a predetermined width on a portion of the side surface of the body of a component. SOLUTION: In a slit 35 disposed in a slit plate 36 of a paste-imparting apparatus, there is provided a flow-passage restricting member 37 for restricting the flow-passage of a conductive paste 32 by dividing its flow-passage into a plurality of passages 38. For imparting the conductive paste 32 present in the slit 35 onto the portion of a side surface 7 of a body 2 of a component, the conductive paste 32 is fed to the side surface 7 so as to raise it on the side of a first principal surface 33 of the slit plate 36. Thereafter, the body 2 of the component is separated from the slit plate 36. At this time, the conductive paste 32 attempts, to turn into a cobwebbed state, according to the separation of the body 2 of the component from the slit plate 36, so as to be cut surely near the flow-passage restricting member 37.
申请公布号 JP2002343691(A) 申请公布日期 2002.11.29
申请号 JP20010147413 申请日期 2001.05.17
申请人 MURATA MFG CO LTD 发明人 OKUYAMA SHINGO
分类号 H01G13/00;(IPC1-7):H01G13/00 主分类号 H01G13/00
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