| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board material used in a novel tape automated bonding(TAB) method having excellent solder heat resistance, and to provide a TAB tape using the same, a board for connecting a semiconductor integrated circuit, and a semiconductor device. SOLUTION: The circuit board material comprises at least an adhesive layer, and an insulating film layer. A water absorption rate of the film layer is 1.2% or less, and a thermal conductivity is 0.25 W/m.K or less. The circuit board material comprises at least one conductor layer and an insulating film layer. The water absorption rate of the film layer is 1.2% or less, and the thermal conductivity is 0.25 W/m.K or less.
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