WIRING BOARD, MANUFACTURING METHOD THEREOF, MULTI-CHIP MODULE, MANUFACTURING METHOD THEREOF, AND MULTI-CHIP MODULE MOUNTING STRUCTURE BODY

摘要

PROBLEM TO BE SOLVED: To provide a multi-chip module wherein an electronic part is soldered to a wiring board (module board) comprising a high-density wire excellent in electric characteristics, which is molded with a molding resin. SOLUTION: A wire composed of Cr (barrier film)/Cu (conductor film)/Cr (barrier film) sputter-filmed at a part working as a ground is used. On Cr/Cu where a wire is sputter-filmed in which a signal passes while jointed to solder, a wire composed of an electric copper plated film and an electric nickel plated film is formed for a wire excellent in electric characteristics.