TAPE CARRIER PACKAGE FOR MOUNTING PLURAL SEMICONDUCTOR CHIPS AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A tape carrier package for mounting plural semiconductor chips and a method for fabricating the same are provided to minimize a size of package by packaging a plurality of semiconductor chips with one package. CONSTITUTION: A conductive pattern(13) is formed on a surface of an insulating film(11). A protective film is formed on a surface of the conductive pattern(13). The conductive pattern(13), the first semiconductor chip(15), and the second semiconductor chip(17) are electrically connected by a bump. The insulating film(11) having the conductive pattern(13) is folded as much as 180 degrees. The first semiconductor chip(15) and the second semiconductor chip(17) are mounted between the folded parts of the insulating film(11). The folded parts of the insulating film(11) are adhered to each other by an adhesive. Accordingly, a plurality of semiconductor chips can be packaged by one tape carrier package.