| 摘要 |
<p>PROBLEM TO BE SOLVED: To suppress temperature changes in a holding member for holding a wafer. SOLUTION: Aluminium alloy is used as a material of a spin chuck 60. A temperature-adjusting member 64, of substantially a cylindrical shape for adjusting temperature of the spin chuck 60, is provided outside of a supporting portion 62 of the spin chuck 60. A Peltier element 65 is incorporated in the temperature-adjusting member 64. A temperature sensor 68 is provided on the spin chuck 60. The heating value of the Peltier element 65 is controlled by a control device 67, based on the value of the temperature sensor 68. Accordingly, the temperature of the spin chuck 60 is adjusted to a predetermined temperature and temperature changes are suppressed. Furthermore, a gap D is provided between the temperature adjusting member 64 and the spin chuck 60, and a magnetic fluid F is filled in the gap D; while the spin chuck 60 and the temperature adjusting member 64 are maintained in a non-contact state, the heat of the temperature adjusting member 64 can be transferred efficiently to the spin chuck 60.</p> |
