发明名称 METHOD OF MANUFACTURING PRINTED WIRING BOARD, METHOD OF MANUFACTURING PREPREG, AND METHOD OF MANUFACTURING MULTILAYERED PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board by which the cost of a printed wiring board can be reduced and the mass- productivity of the board can be improved. SOLUTION: This method of manufacturing a printed wiring board includes a step of supplying a base material from a base material roll 101, a step of respectively laminating two pieces of copper foil 107 and 112 upon both surfaces of the base material supplied from the roll 101, and a step of performing pattern formation on the base material upon which the foil 107 and 102 are laminated. This method also includes a step of cutting the pattern-formed base material into pieces of a prescribed size. In this method, the steps from the step of supplying the base material to the step of performing pattern formation are substantially performed on the base material roll 101.
申请公布号 JP2002344109(A) 申请公布日期 2002.11.29
申请号 JP20010143857 申请日期 2001.05.14
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 OKIMOTO RIKIYA;UEDA YOJI;MATSUOKA SUSUMU;NAKAYA YASUHIRO
分类号 B32B15/08;H05K3/00;H05K3/06;H05K3/40;H05K3/46;(IPC1-7):H05K3/00 主分类号 B32B15/08
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