| 摘要 |
PROBLEM TO BE SOLVED: To provide an efficient method of manufacturing a laminated ceramic electronic component by which through holes for via hole conductors can be formed for a plurality of ceramic green sheets in a batch even when a complicated state of the via hole conductor is required. SOLUTION: When a through hole 18 for a via hole conductor 13 is formed, a plurality of ceramic green sheets 12 are stacked to form a preparatory laminate 15, 16, and then both fully penetrating passages 19, 21, of which both ends to be through holes 18 are opened, and a half-penetrating passage 20, of which only one end is opened, are formed. A conductive paste 22 is filled in the fully penetrating through holes 19, 21 and the half-penetrating through hole 20 to form via hole conductors 13. Then, the preparatory laminates 15, 16 are stacked to obtain a raw laminate 11 for a laminated ceramic electronic component such as a multilayer ceramic board. |
