| 摘要 |
PROBLEM TO BE SOLVED: To obtain a surface acoustic wave device, having a structure formed by flip-chip method in which stresses due to temperature variation are reduced at the joint of a surface acoustic wave element and an electronic component package. SOLUTION: In a surface acoustic wave device 10, where the piezoelectric substrate 1 of a surface acoustic wave element is bonded to an electronic component package 2 via metal bumps 3 (3c, 3m), the piezoelectric substrate 1 has a substantially rectangular bonding face for forming the metal bumps, 3 and the coefficient of linear expansion is different along two side directions of the bonding face. A distance L1 between the metal bumps 3 and 3 separated farthest from each other in the side direction, where the difference of coefficient of linear expansion between the piezoelectric substrate 1 and the electronic component package 2 is large, is set shorter than the distance L2 between the metal bumps 3 and 3 separated most from each other in the direction of the side where the difference of coefficient of linear expansion is small. |
