发明名称 BOARD WITH BUILT-IN CIRCUIT COMPONENTS AND ITS MANUFACTURING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a board that is provided with built-in circuit components, has a large circuit constant and a thin thickness, and is suitable for a laminated structure. SOLUTION: A coil pattern 102, capacitor electrodes 103, and a wiring pattern 104 are formed on at least one surface of a dielectric layer 101 by arranging conductive materials in prescribed patterns. In addition, a magnetic material 105 is arranged in the dielectric layer 101 in the vicinity of the coil pattern 102. Since the coil pattern 102 is formed on the surface of the layer 101 and the magnetic material 105 is arranged in the vicinity of the pattern 102, inductance L can be improved. In addition, a large-capacitance capacitor can be formed by constituting the layer 101 of a material having a high dielectric constant. Consequently, such a thin board with built-in circuit components that a highly functional inductor and capacitor are formed on the common surface of a dielectric layer can be obtained.</p>
申请公布号 JP2002344106(A) 申请公布日期 2002.11.29
申请号 JP20010146930 申请日期 2001.05.16
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 ASAHI TOSHIYUKI;SUGAYA YASUHIRO;KOMATSU SHINGO;YAMAMOTO YOSHIYUKI;NAKATANI SEIICHI
分类号 H05K1/16;H01F27/00;H01F41/04;H01G4/33;H05K3/46;(IPC1-7):H05K1/16 主分类号 H05K1/16
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