| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a printed wiring board for improving contact of an insulating layer and a solder resist layer. SOLUTION: In the printed wiring board, an insulating layer 6, a patterned circuit layer 8, and a solder resist layer 20 are sequentially laminated on a base 2. The solder resist is made of the same material as the insulating layer, and thereby the contact of the insulating layer 6 and the solder resist layer 20 can be improved.</p> |
