| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device capable of high-density mounting and reduction of packaging cost to reduce production cost. SOLUTION: A semiconductor device 2 having solder-plated leads 3 and a flip chip 4 provided with solder bumps 5 or solder balls on the surface of the chip are mounted on a mounting substrate 1 made of a glass epoxy substrate, and the leads and chip are heated so that solder is made to reflow, thereby connecting the terminals of the substrate 1 to the leads 3 of the device 2 and terminals of the flip chip 4. Subsequently, a bare chip 6 is joined and mounted on the substrate 1 with its surface upward, and the pads of the chip 6 are connected to the pads of the substrate 1 by bonding wires 7 using a wire bonding method. Thereafter, the substrate 1, the device 2, flip chip 4 and bare chip 6 which are joined and mounted on the substrate 1 are sealed with a thermosetting epoxy resin 8 at 180 deg.C or low. |
