ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR WAFER

摘要

PURPOSE: To prepare an adhesive sheet for processing a semiconductor wafer, with no volatile component from the adhesive sheet, capable of preventing a deformation of the wafer by a volatilized gas component and a remaining of a paste caused by this deformation at the time of processing of the wafer carried out under vacuum. CONSTITUTION: The adhesive sheet for processing a semiconductor wafer is the one used for fixing the wafer when the semiconductor wafer is processed under vacuum. It is characterized that the adhesive sheet comprises a base material; and an ultraviolet ray curing type adhesive composition layer comprising an ultraviolet ray curing type copolymer having an ultraviolet polymerizable group at a side chain and a phosphor based photopolymerization initiator and formed on one surface or both surfaces of the base material.