发明名称 LIQUID TREATMENT APPARATUS AND METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a liquid treatment apparatus that suppresses the amount of usage in treatment liquid, and at the same time allows the front and rear surfaces of a substrate to be subjected to liquid treatment, and to provide a liquid treatment method. SOLUTION: A washing treatment unit 21a being one embodiment of a liquid treatment apparatus has a spin chuck 23 for retaining a wafer W nearly horizontally, a stage 24 nearly horizontally provided at the lower section of a wafer being retained by the spin chuck 23, and a washing liquid supply hole 41 for supplying specific washing liquid to the clearance between the wafer W retained by the spin chuck 23 and stage 24. The surface of the stage is coated with a hydrophobic polymer so that wettability where the contact angle of the washing liquid becomes at least 50 degrees is provided, and the layer of the washing liquid is formed in the clearance between the wafer W being retained by the spin chuck 23 and stage 24, thus allowing the wafer W to be subjected to liquid treatment.
申请公布号 JP2002343759(A) 申请公布日期 2002.11.29
申请号 JP20010150283 申请日期 2001.05.21
申请人 TOKYO ELECTRON LTD 发明人 TOSHIMA TAKAYUKI;ORII TAKEHIKO
分类号 G02F1/13;G02F1/1333;H01L21/304;(IPC1-7):H01L21/304;G02F1/133 主分类号 G02F1/13
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