MANUFACTURING METHOD OF ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic device for reducing cracks and the like on a wiring board when the electronic part is mounted on the wiring board. SOLUTION: While an opposed region 11 of the wiring board 2 is supported by a supporting member 1 having a projected part 1a with a thickness larger than that of a metalized layer 3b formed on the lower face 2a of the wiring board, an electronic part 7 is mounted.