发明名称 ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREFOR AND ELECTRONIC CIRCUIT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an electronic component of high reliability comprising a resin-sealed body, incorporating a surface acoustic wave device in which the height can be made uniform, when the electronic component is mounted on a circuit board and to facilitate electromagnetic shielding of the device. SOLUTION: The electronic component comprises a surface acoustic wave device 5, in which the active region is protected by a hollow cover 6 and a bump electrode 7, is formed on an electrode pad, an insular conductor 4 disposed opposite to the major surface of the cover 6, a lead 3 having one major surface connected with the bump electrode 7, and a body 1 resin sealing them where the other major surfaces of the lead 3 and the insular conductor 4 are exposed from the bottom face of the sealing body 1. An electronic component, having high dimensional accuracy, can be manufactured easily by forming the lead and the island-form conductor, using a transfer-forming material where a stripping layer and a metal layer are formed on a carrier.
申请公布号 JP2002344283(A) 申请公布日期 2002.11.29
申请号 JP20010147377 申请日期 2001.05.17
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NANBA AKIHIKO;ONISHI KEIJI;SUGAYA YASUHIRO;MORITOKI KATSUNORI
分类号 H01L23/12;H03H3/08;H03H9/25;(IPC1-7):H03H9/25 主分类号 H01L23/12
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