METHOD OF FILLING CONDUCTIVE PASTE IN BLIND VIA HOLE

摘要

PROBLEM TO BE SOLVED: To provide a method by which a conductive paste can be readily filled in a blind via hole on a board such as a printed board without leaving unfilled portions. SOLUTION: When a conductive paste is filled in a blind via hole provided on a board, the conductive paste is printed or applied on the via hole and pressed by a vacuum compression molding machine to fill the conductive paste in the via hole. Then, the conductive paste is further printed or applied on the via hole and cured by vacuum pressurizing and heating.