| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface treatment method of a printed wiring board for improving junction strength without causing blocking by metal particles as an abrasive member or a deterioration in characteristics of the solder resist layer. SOLUTION: The surface treatment method for the printed wiring board having connecting electrodes 12A and 12B exposed partly from the surface covered with an organic resin layer 10 includes a surface roughening step of forming unevenness of the surface of the electrodes by spouting an abrasive solution LQ, in which metallic particles 14 made of materials other than the electrode and having a prescribed grain size is mixed in a solution, to the surface of the printed board, and a cleaning step of the surface of the printed wiring board by using an etching solution that melts only the metal particles. As a result, the junction strength can be improved without blocking by abrasive metal particles or the deterioration in characteristics of the solder resist layer.
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