| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a flexible circuit board having high conductivity reliability. SOLUTION: Metallic layers 2 are respectively formed on the front and rear surfaces of a tape-shaped insulating base film 1 and through holes 3 and sprocket holes 4 are made through the film 1 and metallic layers 2 using a die, drill, etc. Then cylindrical metallic materials 5 are press-fitted in the through holes 3 and plated layers 6 are formed on the external surfaces of the metallic layers 2 so as to integrate the metallic layers 2 with the conductive materials 5. In addition, required resist circuits are formed on the external surfaces of the plated layers 6 and the metallic layers 2 to which the plated layers 6 are adhered are formed in required circuit patterns 8 by etching and resist peeling. Finally, the flexible circuit board is obtained by coat plating 9 on the circuit patterns 8.
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