| 摘要 |
PROBLEM TO BE SOLVED: To stabilize the quality of connection of a bonding wire when the bonding wire is connected. SOLUTION: In a cut clamper, a bonding wire (such as a gold wire) is pinched between a pinching electrode 16 mounted on a fixed plate 12 and a pinching electrode 17 mounted on a movable plate 14, and a discharge voltage is applied to the gold wire to form a gold ball on the point of the gold wire. At this time, as rectangular surfaces are used for the action surfaces pinching the gold wire of the electrodes 16 and 17, the electrodes 16 and 17 pinch the same length of the gold wire between them even though the gold wire is shifted from its center. As a result, the size of the gold ball formed on the point of the gold wire by an atmospheric discharge is stabilized and the quality of connection of the bonding wire is stabilized. |
