发明名称 Semiconductor device and method for manufacturing the same
摘要 A semiconductor device, comprises a first electrode, a semiconductor film, a first insulating film and a second insulating film formed between the semiconductor film and the first electrode, a second electrode, and a third insulating film formed between the semiconductor film and the second electrode. The semiconductor film is formed on a flat surface of the second insulating film. A cross portion where the first electrode and the second electrode cross the semiconductor film at the same position is formed. The first electrode and the second electrode are connected to each other through an opening made in the first insulating film and the second insulating film outside the cross portion.
申请公布号 US2002175328(A1) 申请公布日期 2002.11.28
申请号 US20020105625 申请日期 2002.03.26
申请人 SEMICONDUCTOR ENERGY LABORATORY CO. LTD. 发明人 TSUNODA AKIRA;YAMAZAKI SHUNPEI;KOYAMA JUN
分类号 H01L21/336;H01L21/77;H01L21/84;H01L27/12;H01L29/423;H01L29/786;(IPC1-7):H01L29/04;H01L31/036;H01L31/037;H01L31/20 主分类号 H01L21/336
代理机构 代理人
主权项
地址