CURED THERMOSETTING RESIN PRODUCT

摘要

A cured thermosetting resin product having high heat conductivity, characterized in the resin component thereof has an anisotropic structure, an anisotropic structure unit constituting the anisotropic structure has a covalent bonding portion, the maximum diameter of the anisotropic structure unit is 400 nm or more, and the resin component contains the anisotropic structure in an amount of 25 vol % or more. The resin component of the cured thermosetting resin product having high heat conductivity is preferably a cured epoxy resin comprising an epoxy resin monomer and an epoxy resin curing agent. The epoxy resin monomer is preferably represented by the following general formula (1): E − M − S − M − E ....(1) wherein E, M and S represent an epoxy group, a mesogen group and a spacer part, respectively. The cured thermosetting resin product is significantly improved in heat conductivity.