METHOD FOR MANUFACTURING CERAMIC MULTILAYERED BOARD
摘要
<p>A manufacturing method including the step of forming an adhesive layer(12)over the surface of a ceramic substrate(11)enables the manufacture of a ceramic multilayered circuit board of a high dimensional precision comprising a monolithic block of the ceramic substrate(11)and a ceramic green sheet(14)with almost no in−plane shrinkage after baking.</p>
申请公布号
WO02096172(A1)
申请公布日期
2002.11.28
申请号
WO2002JP04916
申请日期
2002.05.21
申请人
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;HASHIMOTO, AKIRA;NAKAO, KEIICHI;KATSUMATA, MASAAKI
