| 摘要 |
<p>In a lead-frame configuration (1), which has a frame base (3) and a multiplicity of lead-frames (6, 7, 8, 9, 10, 11) connected with the frame base (3) and intended to hold a chip each, each lead-frame (6, 7, 8, 9, 10, 11) has two connecting plates (12, 13), and each connecting plate (12, 13) is connected with the frame base (3) via connecting webs (28, 29, 30, 31, 32, 33) and the two connecting plates (12, 13) of each lead-frame (6, 7, 8, 9, 10, 11) delimit a bridging zone (34) which can be bridged using a chip and which is formed by only a narrow air gap (34) so that the two connecting plates (12, 13) of each lead-frame (6, 7, 8, 9, 10, 11) about each other directly without a further intermediate section of the lead-frame concerned.</p> |
