SILICONE COMPOSITION AND THERMALLY CONDUCTIVE CURED SILICONEPRODUCT

摘要

A silicone composition for preparing a cured silicone product, the compositi on comprising (A) an organopolysiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule; (B) an organohydrogenpolysiloxan e containing an average of at least two silicon-bonded hydrogen atoms per molecule in a concentration sufficient to cure the composition; (C) an alumi na filler in a concentration sufficient to impart thermal conductivity to the cured silicone product; (D) an effective amount of a polyether; and (E) a catalytic amount of a hydrosilylation catalyst. A cured silicone product comprising a reaction product of the silicone composition.