发明名称 Processes for polishing wafers
摘要 Processes for polishing acid etched wafers include contacting wafers, such as a silicon wafers, with an aqueous hydrogen peroxide solution, and then polishing the wafers with an aqueous alkaline slurry. The processes can prevent edge stain by forming a passivation layer on the wafers.
申请公布号 US2002175143(A1) 申请公布日期 2002.11.28
申请号 US20010861543 申请日期 2001.05.22
申请人 SEH AMERICA, INC. 发明人 COOPER STEVEN P.
分类号 H01L21/306;(IPC1-7):B44C1/22;H01L21/302 主分类号 H01L21/306
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