Electronic component used as a semiconductor component comprises a passive component, and a semiconductor chip electrically connected to a wiring structure

摘要

Electronic component comprises a semiconductor chip (4) and a passive component (7). The chip is electrically connected to a wiring structure which is enclosed together with the passive component and the chip by a plastic housing (14). An Independent claim is also included for a process for the production of the electronic component. Preferred Features: The wiring structure is three-dimensional. The passive component is electrically connected to the chip using bonding wires (13). The passive component is connected to the chip using Flip-Chip technology. The passive component is an adjustable electrical resistor. An insulator (5) is arranged between the chip and passive component.