发明名称 |
Method for forming a gate dielectric layer by a single wafer process |
摘要 |
A method for forming a gate dielectric layer by a single wafer process is provided. The method for forming a gate dielectric layer by a single wafer process is accomplished by two steps respectively performed in a single-wafer chamber and a single-wafer rapid thermal processing (RTP) chamber. First, by placing a silicon wafer in the single-wafer chamber and performing a nitridation process to form a nitrogen-contained silicon oxide layer on the surface of the silicon wafer. Then, placing the silicon wafer in the single-wafer RTP chamber and performing an in-situ steam generation (ISSG) oxidation process to oxidize the nitrogen-contained silicon oxide layer to a silicon oxide layer with an oxynitride bottom layer serving for a gate dielectric layer.
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申请公布号 |
US2002177327(A1) |
申请公布日期 |
2002.11.28 |
申请号 |
US20010861655 |
申请日期 |
2001.05.22 |
申请人 |
MACRONIX INTERNATIONAL CO., LTD |
发明人 |
LUOH TUUNG;LIN HANS;HWANG YAW-LIN |
分类号 |
H01L21/28;H01L21/314;H01L29/51;(IPC1-7):H01L21/31 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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